Materials for Electronic Packaging edited by CHUNG, DEBORAH D.L.
Material type:
TextPublication details: New delhi BUTTERWORTH HEINEMANN 1995 Subject(s): ELECTROICS PACKAGING -MATERIALS | ENGINEERINGMICROELECTRONICS
COMMUNICATION | ELECTRONICS AND COMMUNICATION ENGINEERINGDDC classification: 621.381
| Item type | Current library | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
General Books
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Malaviya National Institute of Technology | 621.381 CHU (Browse shelf(Opens below)) | Available | 55043 |
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| 621.381 CHA Electronics Laboratory Primer | 621.381 CHA Electronics Laboratory Primer | 621.381 CHU Electronics in Industry | 621.381 CHU Materials for Electronic Packaging | 621.381 CRA Electronics via Waveform Analysis | 621.381 CRE Electronics | 621.381 DEB Integrated Circuits and Semiconductor Devices |
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