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Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal integrity, Power Integrity and EMC

by LI, ER-PING.

Material type: Text Text; Format: print ; Literary form: Not fiction Publication details: Hoboken(USA) Wiley 2012Availability: Items available for loan: Malaviya National Institute of Technology (2)Call number: 621.3815 LI,C1, ...

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Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by LI, ER-PING.

Material type: Text Text; Format: print ; Literary form: Not fiction Publication details: Hoboken(USA) Wiley 2012Availability: Items available for loan: Malaviya National Institute of Technology (1)Call number: 621.3815 LI.

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