| 000 | 00498pam a2200145a 44500 | ||
|---|---|---|---|
| 008 | 140414b1995 xxu||||| |||| 00| 0 eng d | ||
| 082 |
_a621.381 _bCHU |
||
| 245 |
_aMaterials for Electronic Packaging _cedited by CHUNG, DEBORAH D.L. |
||
| 260 |
_aNew delhi _bBUTTERWORTH HEINEMANN _c1995 |
||
| 650 | _a ELECTROICS PACKAGING -MATERIALS | ||
| 650 | _aENGINEERINGMICROELECTRONICS COMMUNICATION | ||
| 690 | _aELECTRONICS AND COMMUNICATION ENGINEERING | ||
| 700 | _aCHUNG, DEBORAH D.L. | ||
| 906 | _a16748 | ||
| 999 |
_c16174 _d16174 |
||