| 000 | 00571pam a2200169a 44500 | ||
|---|---|---|---|
| 008 | 140414b1992 xxu||||| |||| 00| 0 eng d | ||
| 082 |
_a621.38105 _bMGR |
||
| 245 |
_aElectronic Engineering Vol-64 _cedited by Neale, Ron |
||
| 260 |
_aLONDON _bMORGAN GRAMPIAN PLC _c1992 |
||
| 650 | _a FRACTURE MECHANICS --CONGRESSES. | ||
| 650 | _a ELECTRONIC PACKAGING --CONGRESSES. | ||
| 650 | _a ELECTRONIC ENGINEERING VOL-64 | ||
| 650 | _aELECTRONICS AND COMMUNICATION ENGINEERING | ||
| 690 | _aELECTRONICS AND COMMUNICATION ENGINEERING | ||
| 700 | _aNeale, Ron | ||
| 906 | _a43835 | ||
| 999 |
_c41466 _d41466 |
||