| 000 | 00574pam a2200181a 44500 | ||
|---|---|---|---|
| 008 | 140414b2012 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9780470623466 | ||
| 082 |
_a621.3815 _bLI |
||
| 100 | _aLI, ER-PING | ||
| 245 |
_aElectrical Modeling and Design for 3D System Integration _b3D Integrated Circuits and Packaging, Signal integrity, Power Integrity and EMC _c |
||
| 260 |
_aHoboken(USA) _bWiley _c2012 |
||
| 300 | _axiv,366p. | ||
| 650 | _a ELECTRICAL ENGINEERING | ||
| 650 | _a EMC | ||
| 650 | _a3D INTEGRATED CIRCUITS | ||
| 690 | _aELECTRICAL ENGINEERING | ||
| 906 | _a592 | ||
| 999 |
_c571 _d571 |
||