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Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

By: LI, ER-PINGMaterial type: TextTextPublication details: Hoboken(USA) Wiley 2012 Description: xiv,366pISBN: 9780470623466Subject(s): ELECTRICAL ENGINEERING | THREE-DIMENSIONAL INTEGRATED CIRCUITS | ELECTRICAL ENGINEERINGDDC classification: 621.3815
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