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Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal integrity, Power Integrity and EMC

By: LI, ER-PINGMaterial type: TextTextPublication details: Hoboken(USA) Wiley 2012 Description: xiv,366pISBN: 9780470623466Subject(s): ELECTRICAL ENGINEERING | EMC | 3D INTEGRATED CIRCUITS | ELECTRICAL ENGINEERINGDDC classification: 621.3815
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Holdings
Item type Current library Call number Status Date due Barcode
General Books General Books Malaviya National Institute of Technology
621.3815 LI,C1 (Browse shelf(Opens below)) Available 81668
General Books General Books Malaviya National Institute of Technology
621.3815 LI (Browse shelf(Opens below)) Available 81667

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